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Bengaluru, India, [1 December 2025]
Sunstream Global Technologies, a leading product engineering services company, today announced that it will use Hexagon’s top analysis tools, Nastran and APECS, to improve its simulation and engineering analysis offerings for customers worldwide.
This addition boosts Sunstream's skills in Finite Element Analysis (FEA), structural simulation, thermal and vibration analysis, and complex multi-physics modeling. By integrating Nastran and APECS into its engineering toolkit, Sunstream will help customers speed up product development, improve reliability, and cut prototyping costs. “As product design cycles shrink and complexity grows, our customers expect deeper engineering insights, faster analysis, and higher precision,” said Unni Mecheeri, Director of Sunstream Global Technologies. “The adoption of Nastran and APECS shows our commitment to providing top-notch engineering analysis services backed by strong simulation technologies.
Hexagon’s Nastran solver is known worldwide for its precision in structural analysis. APECS offers powerful pre- and post-processing features that enable engineers at Sunstream to solve difficult engineering challenges in aerospace, automotive, industrial equipment, consumer electronics, and energy sectors. This upgrade supports Sunstream’s long-term AI-integrated engineering plan. It ensures customers get high-value, simulation-driven insights at every stage of product development.
Sunstream Global Technologies
No:25, Ashok Chambers, Intermediate Ring Road, Koramangala, Bangalore – 560 047.
Media Contact: Charulatha
Tel : +1 585 935 7123
Mob: +91 804 148 6861
Email : info@sunstreamglobal.com
Web : www.sunstreamglobal.com