About

CrossFire Technologies Inc., a fabless semiconductor company, is expanding the Open Chiplet Economy. Chiplets are becoming ubiquitous in accelerated and embedded computing SoCs. However, several pain points are slowing the growth and hampering an open chiplet economy. CrossFire offers a holistic and non-captive approach to Chiplet development and integration with a suite of products to shorten time to market and reduce costs.  For example, customers who use CrossFire’s Bridgelet™ can shave up to a year off of development schedules as well as reduce valuable interface die area by 50x and lower power use by 10x with the included Direct Chiplet Interface™(DCI).  CrossFire also offers OmniDie™, a unique approach to chiplet integration that does not require interposers or a package laminate.  With OmniDie, customers can avoid interposer availability constraints and other expensive alternatives, saving development time and money.