Teledyne Microelectronics, a DOD Trusted Source for Microelectronics Packaging, is a leading supplier of microelectronics assembly and packaging solutions.  For over 50 years, we have provided innovative approaches in packaging and testing of microcircuits, multichip modules and multichip assemblies for high-reliability applications. In our DoD cleared facility in Lewisburg, Tennessee and our Engineering Design Center in Los Angeles, California, we utilize the latest first level interconnect technologies including flip chip assembly, wire bonding, 3-D stacking and provide a wide range of techniques for IC packaging including multichip modules, hybrid circuits, BGA, CGA assembly, chip on board, chip on flex, CLCC (ceramic leadless chip carrier) and system in package.